2012-07-07

色眼辨别翡翠身价

色眼辨别翡翠身价

黄翡莲花佛。 黄翡莲花佛。

  不仅是生意人,还是知音人

  早在200年前的皇室贵族,翡翠就被广泛运用于首饰加工和工艺品雕刻中。在中国传统文化中,“大红大绿”是吉祥如意的象征,更是人们喜闻乐见的搭配。比起皇室御用的明黄色,翡翠的翠绿鲜亮更能体现出贵族至高无上的气质。“每一块翡翠都有它自己的故事”。店主高先生告诉笔者,经营翡翠生意不仅仅要能辨别出好坏,更要了解翡翠的历史文化,这样才能针对顾客不同的要求为其推介最适合的配搭。高先生这些年不仅是个生意人,更成为翡翠的知音人。他说,翡翠是大自然的恩赐,每一件都是独一无二的艺术品,精心雕琢出的翡翠饰品寄托的是人们美好的祝愿,能将如意、平安的能量传达给他人,因此成为许多人佩戴或收藏的最爱。

  “黄袍袈裟”身价不菲

  古语说:“玉不琢不成器”,任何一块好的玉石,都需要经过人工雕琢,才能赋予它新的价值和魅力。高先生从展柜里拿出一块身价不菲的黄翡巧雕的摆件告诉笔者,人们印象中的翡翠多数是翠绿色的,其实翡翠中的翡指的是黄翡。笔者在现场看到,这尊佛像造型的摆件光泽明亮,黄翡包裹一周,色彩柔和,雕工师傅巧妙地运用了边上的“翡”,设计出黄袍袈裟的视觉效果,配以莲花、祥云的木质底座,将莲花送佛形象刻画得惟妙惟肖。高先生说,黄袍袈裟的造型是源于他的创意。

  翡翠竟有七种颜色

  据了解,对于翡翠的“种”业界说法不一,但对其颜色的认知比较统一,价格衡量标准也比较一致。高先生向笔者展示了一款难得一见的满绿挂件。笔者在现场看到,这件满翠的福瓜水头十足,阳绿满色,艳丽润亮,时尚大方。更难得的是福瓜块头竟有4厘米大,瓜又多子,用来比喻子孙延绵不断。高先生说,翡翠体现的是东方古典美,追求含蓄与隽永。目前来说,翡翠基本可分为黄、绿、白、紫、黑、白底飘花、红七个颜色,最为常见的是黄色与绿(青)色两种,也是中国古代“翡”与“翠”的同义词。

  稿件由朝天宫古玩市场提供


TAG:色眼辨别翡翠身价

赌石成勇敢者的游戏原石交易价格飙升

赌石成勇敢者的游戏原石交易价格飙升

  今年5月,云南保山的玉石毛料没赌就开,事主被保山法院判赔25万。

  据悉,保山的乔女士经营玉石毛料的加工和销售,她委托同行法先生带玉石毛料去昆明销售。法先生未经乔女士同意,在交易之前擅自将一块9.6公斤重的毛料解剖开,使其失去交易价值。经过诉讼,保山市法院裁定:剖开的玉石毛料归属被告,按照双方原来的价值约定,被告赔偿原告25万元。法院此案中的裁定依据就是玉石行业中约定俗成的规矩——“赌石”。

  翡翠原石价值“赌出来”

  “神仙难断寸玉,大师往往失手。”史上最著名的一块赌石就是和氏璧。

  相传在二千多年前的楚国,卞和发现一块玉璞,他先后献给楚国的两位国君,国君以为受骗而先后砍去了他的左右腿。他抱着玉璞在楚山上哭了三天三夜,后来楚文王知道了,就让玉工剖开玉璞,结果现出一块天下无双的美玉,将它雕成“和氏璧”。后来这块美玉被赵惠王拥有,秦昭王希望用十五座城池来换这块宝石,才有了蔺相如“完璧归赵”的故事。据说,和氏璧后来雕成了传国玉玺,一直到西晋才失传。这段渊源被写进了三国演义,流传甚广。

  玉石行的人戏称卞和是杰出的赌石大师。翡翠原石开采出来时包裹着一层风化皮,尚无任何设备和技术能探测出里面的材质和价值,购买翡翠原石主要依靠经验与眼光,带有与天赌运的色彩,因此人称赌石。

  赌石作为一种独特的高档翡翠原石交易方式,近几十年来在滇缅边界兴起。对一块未经开窗的原石,赌石人凭经验,依据皮壳上的表现,反复猜测和判断,以估出的价格买下。一刀剖开,可能里边色好水足,价值倍增,也可能里边无色无水,转眼一文不值。赌石的风险人称“一刀穷,一刀富,一刀穿麻布”,一块石头可能使人暴富,也可能使人一夜之间倾家荡产。

  “疯子卖,疯子买,还有疯子在等待。”赌石,与太多的一夜暴富的故事相连,随着翡翠原石越来越少和大量游资的进入,原石交易价格飙升,赌石渐趋疯狂。

  赌石不只靠运气

  据介绍,国内赌石市场在2005年开始升温,近年来,由于翡翠资源的日益稀缺,翡翠原石成为收藏品,赌石成为一种投资手段,受到藏家追捧,赌石市场行情一路走高,甚至超过翡翠成品每年30%到40%的涨幅。

  业内人士认为,赌石市场看似火爆,但泥沙俱下,假货横行。目前赌石的造假手段有十几种,鉴定手段都是跟着造假手段跑,防伪跟不上造假。赌石市场秩序混乱,赌石的价格基本上是由赌石厂家自己确定,不能形成市场统一的定价标准。

  在云南瑞丽翡翠毛料拍卖市场,赌石交易有其严格的程序,并不只靠运气。

  据介绍,瑞丽翡翠毛料拍卖市场业内称为翡翠毛料公盘,每隔三个月开盘一次,一年四次,所有将要出售的毛料都按规定编好号码,注明件数、重量和底价,全程实行暗标交易,即买家看了底价后,分别将自己的竞拍价投入标箱,等待拍卖会按竞价最高者公布中标结果。为了杜绝流拍、乱拍、冒投现象,公盘设置了门槛,即只有瑞丽市珠宝协会注册会员才能参加,普通市民和游客只能参与平时的常规赌石活动或选择杂石区的石头。

  事实上,与人们印象中充满风险的“摸黑盲赌”不同,公盘交易现场大部分原石已被人工切开,肌理必现。据介绍,赌石分为全赌,半赌和明料三种。其中,全赌是原石完全被皮壳包裹,未作任何处理,购买者只能通过强光电筒判断石头价值,风险极高;半赌则是指原石被擦开了一个小口,也称“开窗”,风险稍小;明料是指原石已由人工切开,也称“开门”,风险最小。在瑞丽公盘现场,全赌的石料只占两成,交易双方均更倾向于风险相对小的半赌与明料。

  冯令山浸润玉石行业20余年,因眼光精准,经验丰富,人称“赌石大王”,他讲过一个赌石的故事:2010年9月中旬,他的朋友到缅甸花1600元人民币,折合23万缅币,买下一块重2公斤,皮壳灰白、很薄的原石,石头没有任何开口,是全赌,而后把石头开了窗,擦出一个小口,一看是细腻透明的玻璃种,还带翠,当场就有广东的客商抢着出价20万人民币买走。广东客商切开了这块原石,种老质均,水头十足,原来是一块上品中的上品,最终这块原石卖出一千万元。冯令山说:“赌石有时不是一个人就能完成,一块原石从缅甸到云南再到广东,通常销售好几道,击鼓传花,越赌越大。”

  但在现实中,这样的传奇少之又少,更多的是赌输的案例。

  在玉石行当内,切割石头的过程叫作“解石”,成功的叫做“涨”,失败的则叫作“垮”,瑞丽赌石城内的小李每天至少要“解”十五、六块石头,在角落里堆着不少“解垮”了被买主直接废置的原石。很多赌石者在“解石”的过程中,不愿轻易透露购买原石的价格,“解涨”了才告知众人,“解垮”了通常安静消失,这让原本就不太透明的赌石活动更添神秘色彩。

  实际上,专业玉器公司购买原石,更多的是选择明料,即已开了一半的玉石。近年来,赌石以其刺激性和神秘性引发关注,国内不少地方扎堆出现“赌石俱乐部”,以普通消费者为目标群体,让圈外的人也能“一赌为快”。据瑞丽专业人士看来,随着原石资源的日益紧缺,缅甸正在控制上等原石的出口,外行既缺乏经验,也没有专业常识,想花小钱捡大漏基本不太可能。萧蔷


TAG:赌石成勇敢者的游戏原石交易价格飙升

NXP Semi realigns management team

NXP Semi realigns management team

NEW YORK -- NXP Semiconductor's management team saw more changes recently as its chief technology officer, René Penning de Vries, stepped down after residing with the company for more than 26 years.

The shakeup comes just months after the resignation of its chief financial officer, Karl-Henrik Sundström. A spokesperson for the company said that both departures were due to personal reasons.

"These are personal changes and they don't have anything to do with [financial] results whatsoever," he said.

NXP [Eindhoven, Netherlands], a leading manufacturer of high-performance mixed-signal and standard products, had a rocky start to 2012 with year-on-year quarterly sales and net income dipping sharply in the first quarter. On a non-GAAP basis, sales fell 9.6 percent to $978 million, while net income fell 59 percent to $48 million. The company is scheduled to release its second-quarter results on July 26.

NXP also appointed Sean Hunkler as executive vice president and co-general manager of operations effective July 16. Hunkler will take over for Peter Kelly, who is now NXP's new CFO. Along with Chris Belden, Hunkler will be responsible for all aspects of the company's global operations.

Hans Rijns, senior vice president research and development, will take over as interim CTO. An announcement of his successor is expected soon.

"The [management changes] don't have any consequences for our product or R&D roadmaps whatsoever," the spokesperson said.
TAG:NXP semiconductor

NXP Semi realigns management team

NXP Semi realigns management team

NEW YORK -- NXP Semiconductor's management team saw more changes recently as its chief technology officer, René Penning de Vries, stepped down after residing with the company for more than 26 years.

The shakeup comes just months after the resignation of its chief financial officer, Karl-Henrik Sundström. A spokesperson for the company said that both departures were due to personal reasons.

"These are personal changes and they don't have anything to do with [financial] results whatsoever," he said.

NXP [Eindhoven, Netherlands], a leading manufacturer of high-performance mixed-signal and standard products, had a rocky start to 2012 with year-on-year quarterly sales and net income dipping sharply in the first quarter. On a non-GAAP basis, sales fell 9.6 percent to $978 million, while net income fell 59 percent to $48 million. The company is scheduled to release its second-quarter results on July 26.

NXP also appointed Sean Hunkler as executive vice president and co-general manager of operations effective July 16. Hunkler will take over for Peter Kelly, who is now NXP's new CFO. Along with Chris Belden, Hunkler will be responsible for all aspects of the company's global operations.

Hans Rijns, senior vice president research and development, will take over as interim CTO. An announcement of his successor is expected soon.

"The [management changes] don't have any consequences for our product or R&D roadmaps whatsoever," the spokesperson said.
TAG:NXP semiconductor

Aeroflex offers 16-Mbit, 64-Mbit rad-hard MRAMs

Aeroflex offers 16-Mbit, 64-Mbit rad-hard MRAMs


LONDON – Aeroflex Inc., a supplier of electronic components for military and aerospace applications, has announced the availability of three magnetoresistive random access memory (MRAM) components made using a manufacturing license from Everspin Technologies Inc. (Chandler, Ariz.).

The UT8MR2M8 is a 16-Mbit device offered in a 40-lead flatpack package. The 64-Mbit UT8MR8M8 is a multichip module available in a 64-lead flatpack package. Everspin's largest monolithic memory is a 16-Mbit device but it looks like Aeroflex is taking four die and wiring them up in a single package to create the 64-Mbit device.

MRAM technology provides a combination of fast access time, non-volatility, data retention and endurance. The parts are architected as non-volatile replacements for SRAM components.

The 3-V MRAMs have guaranteed operation from -40 to +105 degees C, 100-krads(Si) and are SEL immune to more than 100 MeV-cm2. As a replacement for 3.3-V SRAMs, the MRAMs are 8-bit parallel I/O solutions with data retention after each write of 20 years.

"Using an IP license from Everspin Technologies, Aeroflex has taken commercial MRAM technology and modified it for the specialized aerospace and defense markets in less than two years," said Anthony Jordan, director of standard products at Aeroflex Colorado Springs. "Aeoflex MRAMs will be QML Q and we are striving for QML qualification. We are committed as a long-term supplier of memory products for harsh environments."

Prototypes for the UT8MR8M8 are available now with volume production scheduled to start in 2Q13; the UT8MR2M8 prototypes are available now with production due in one year's time in 3Q13.


Related links and articles:

www.datasheets.com

www.aeroflex.com

News articles:


MRAM firm claims 250 design wins in 2011

Tower makes Ramon rad-hard processor

Aeroflex IPO raises $232 million

Aeroflex Gaisler moves Leon processor on a generation


TAG:Aeroflex MRAM Everspin rad hard semiconductor memory

Derecho exposes our fragile networks

Derecho exposes our fragile networks


WASHINGTON – Among the very bad things that happened here last week (June 29) when a derecho storm hammered the nation’s capital and its suburbs was the collapse of the region’s 911 emergency communications system.

Verizon’s backup power system was supposed to at least keep the 911 network operating despite widespread power outages that kept sweating utility customers in the dark for days. But Verizon’s backup power system failed, much to the horror of local governments and officials who work to maintain emergency communications. “Very troubling,” said one emergency communications specialist with the U.S. Department of Homeland Security.

The aftermath of the huge storm serves as a stark reminder of the fragility of Verizon’s network as well as the need for more reliable sources of backup power needed to keep critical infrastructure like 911 networks online. As millions around here also learned, you can’t do anything without power.

One likely solution is an emerging public safety LTE network called First Responder Network Authority, or FirstNet. The new network is scheduled to begin interoperability testing later this month.

Given the severity of recent summer storms, wild fires in the West and hurricane season peaking in August, the sooner this new network is deployed, the better.

As for backup power, some are advocating that remote cell towers and other network elements use more reliable backup power with higher power densities. One proposal being pitched by energy industry consultants is using lithium ion batteries for backup power. So far, program officials are shying away from the high cost of the emerging battery technologies. Proponents view the new network as a way to scale up Li-ion battery production to reduce manufacturing costs.

Either way, program officials and network operators must find and deploy a fail-safe backup power system so that critical networks like 911 don’t fail the next time a fast-moving derecho storm pops up in the Midwest and knocks out every part of the power grid in its path.
TAG:Critical Infrastructure Emergency Communications Verizon FirstNet 911 Derecho Storms

Aeroflex offers 16-Mbit, 64-Mbit rad-hard MRAMs

Aeroflex offers 16-Mbit, 64-Mbit rad-hard MRAMs


LONDON – Aeroflex Inc., a supplier of electronic components for military and aerospace applications, has announced the availability of three magnetoresistive random access memory (MRAM) components made using a manufacturing license from Everspin Technologies Inc. (Chandler, Ariz.).

The UT8MR2M8 is a 16-Mbit device offered in a 40-lead flatpack package. The 64-Mbit UT8MR8M8 is a multichip module available in a 64-lead flatpack package. Everspin's largest monolithic memory is a 16-Mbit device but it looks like Aeroflex is taking four die and wiring them up in a single package to create the 64-Mbit device.

MRAM technology provides a combination of fast access time, non-volatility, data retention and endurance. The parts are architected as non-volatile replacements for SRAM components.

The 3-V MRAMs have guaranteed operation from -40 to +105 degees C, 100-krads(Si) and are SEL immune to more than 100 MeV-cm2. As a replacement for 3.3-V SRAMs, the MRAMs are 8-bit parallel I/O solutions with data retention after each write of 20 years.

"Using an IP license from Everspin Technologies, Aeroflex has taken commercial MRAM technology and modified it for the specialized aerospace and defense markets in less than two years," said Anthony Jordan, director of standard products at Aeroflex Colorado Springs. "Aeoflex MRAMs will be QML Q and we are striving for QML qualification. We are committed as a long-term supplier of memory products for harsh environments."

Prototypes for the UT8MR8M8 are available now with volume production scheduled to start in 2Q13; the UT8MR2M8 prototypes are available now with production due in one year's time in 3Q13.


Related links and articles:

www.datasheets.com

www.aeroflex.com

News articles:


MRAM firm claims 250 design wins in 2011

Tower makes Ramon rad-hard processor

Aeroflex IPO raises $232 million

Aeroflex Gaisler moves Leon processor on a generation


TAG:Aeroflex MRAM Everspin rad hard semiconductor memory

Derecho exposes our fragile networks

Derecho exposes our fragile networks


WASHINGTON – Among the very bad things that happened here last week (June 29) when a derecho storm hammered the nation’s capital and its suburbs was the collapse of the region’s 911 emergency communications system.

Verizon’s backup power system was supposed to at least keep the 911 network operating despite widespread power outages that kept sweating utility customers in the dark for days. But Verizon’s backup power system failed, much to the horror of local governments and officials who work to maintain emergency communications. “Very troubling,” said one emergency communications specialist with the U.S. Department of Homeland Security.

The aftermath of the huge storm serves as a stark reminder of the fragility of Verizon’s network as well as the need for more reliable sources of backup power needed to keep critical infrastructure like 911 networks online. As millions around here also learned, you can’t do anything without power.

One likely solution is an emerging public safety LTE network called First Responder Network Authority, or FirstNet. The new network is scheduled to begin interoperability testing later this month.

Given the severity of recent summer storms, wild fires in the West and hurricane season peaking in August, the sooner this new network is deployed, the better.

As for backup power, some are advocating that remote cell towers and other network elements use more reliable backup power with higher power densities. One proposal being pitched by energy industry consultants is using lithium ion batteries for backup power. So far, program officials are shying away from the high cost of the emerging battery technologies. Proponents view the new network as a way to scale up Li-ion battery production to reduce manufacturing costs.

Either way, program officials and network operators must find and deploy a fail-safe backup power system so that critical networks like 911 don’t fail the next time a fast-moving derecho storm pops up in the Midwest and knocks out every part of the power grid in its path.
TAG:Critical Infrastructure Emergency Communications Verizon FirstNet 911 Derecho Storms

Tools expand for sensor fusion hubs

Tools expand for sensor fusion hubs


PORTLAND, Ore. -- An expanding suite of algorithms for fusing the outputs from Xtrinsic family of MEMS chips is designed to enable designers to develop sensor fusion algorithms from Freescale Semiconductor application notes or to license a sensor-hub software solution from motion algorithm specialists Movea Inc.

"Sensor fusion covers a variety of techniques ranging from trading off the strengths of one sensor to compensate for weakness in another sensor [to] improving the quality and noise in computed results by using known data redundancies among sensors," said Mike Stanley, IC architect and systems engineer at Freescale (Austin, Texas).

Stanley writes a sensor blog on the latest sensor fusion algorithms and Freescale applications notes for implementing them. One technique enables sensors to minimize power consumption by turning off power to the application processor during periods of inactivity, then restoring power when motion is detected by a MEMS sensor.

Simple applications like compensating for tilt when using magnetometer can be relatively straightforward for engineers to program, but increasingly complex sensor fusion algorithms are a tougher problem when using them to analyze, auto-calibrate and cross-compensate for errors in raw data outputs from multiple MEMS sensors. These sensors include accelerometers, gyroscopes, magnetometers, altimeters along with temperature- and proximity-sensors.

Freescale if offering an expanded sensor toolbox for a fee, and engineers can also license a sensor hub solution from Movea that off-loads the application processor by running core algorithms on a separate Freescale ColdFire microcontroller.

Movea is co-marketing its MotionCore sensor fusion platform with Freescale for use with its Coldfire microcontrollers, said Tim Kelliher, director of customer solution architectures at Movea (Pleasanton, Calif.) "By incorporating sensor fusion into our separate hub, instead of running sensor fusion algorithms on the application processor, designers can create motion-aware applications that are agnostic to hardware," Kelliher added in a statement.

TAG:Sensor Fusion MEMS Sensor Fusion Freescale Movea

Emulex pays Broadcom $58M in patent deal

Emulex pays Broadcom $58M in patent deal

SAN JOSE – Emulex Corp. agreed to pay Broadcom Corp. $58 million in a partial settlement of ongoing patent disputes between the two companies.

Under the deal Emulex gets a license to three Broadcom patents (U.S. Patents Nos. 7,471,691; 7,058,150 and 6,424,194) and related families for use in Fibre Channel products. Emulex in turn will provide “certain rights to Broadcom protecting Broadcom from Emulex patent assertions,” according to a joint statement from the companies.

In addition, Broadcom has agreed to drop some, but not all, of the patent infringement claims it has filed against Emulex. Some terms of the deal were made confidential.

The two companies have been locked in patent disputes since before Broadcom made an unsolicited bid to buy Emulex in April 2009 for $764 million. The move was seen as an attempt by Broadcom to expand into the rapidly growing storage networking market where Emulex had strengths in Fibre Channel over Ethernet and a board-level business.

The Emulex board rejected the bid within days, prompting Broadcom to raise its offer to $912 million which Emulex also turned down. Within two months Broadcom brought a suit for patent infringement against Emulex which won a partial legal victory earlier this year.
TAG:Patent Infringement Storage Networking Fibre Channel Emulex Broadcom Patents Infringement

TI, Stanford explore OpenFlow silicon

TI, Stanford explore OpenFlow silicon

SAN JOSE – Researchers from Stanford University, Texas Instruments and at least one other company are exploring ways to optimize networking chips for the emerging OpenFlow specification. The effort is part of a wider trend toward software-defined networking shaking up the communications industry.

Software-defined networks (SDNs) aim to cut through the complexities of a growing variety of protocols and techniques often coded into silicon that make today’s nets difficult to manage. SDNs also aim to bring the same kind of virtualization capabilities to networks that are now widely used in computers.

The OpenFlow specification developed at Stanford is leading the charge, gaining support in products from Hewlett-Packard, IBM, NEC and and a handful of startups. But some say it is just one approach to creating a software defined network.

The trend could be disruptive for established companies such as Cisco Systems that have deep investments in systems and chips geared to handle today’s protocols.

In an effort to get ahead of the curve, Cisco recently announced a broad initiative called Open Network Environment that it says goes beyond OpenFlow. Meanwhile the company also is developing systems for OpenFlow as part of an internal startup called Insieme, according to a New York Times report.

“In short, Cisco is planning on offering multiple approaches to program networks across its portfolio,” said Nick Lippis, a network analyst, writing for a GigaOM Pro report.

Meanwhile at Stanford, TI and others are collaborating on “a paper design of an OpenFlow optimized switch fabric,” said Martin Izzard, director of systems and applications research at TI.

The project, expected to run through the end of the year, aims to define in silicon “a classification pipeline variable in length and able to look at different kinds of labels or tags,” said Izzard.

The packet lookup and classification techniques in an OpenFlow switch are expected to be relatively generic so they can be flexibly configured as needed by network managers. Indeed, engineers are hammering out a high-level applications programming interface for routers and switches as the next big step in the evolution of the OpenFlow specification.

The goal of OpenFlow is to let end users program network systems using servers as controllers. However, the switches and routers will still require some embedded processing to interpret the APIs and carry out their jobs.

“My gut feel is the [OpenFlow] machines will be more efficient than ones that have to serve a large number of protocols,” said Izzard. “These boxes could be software configured for different protocols and topologies so they could be less power hungry,” he said.

“This is an inflection point in how networks are developed, and that means there’s a chance for markets to change,” Izzard said. “My timeline is this year to understand this market well and see which way it’s going,” he added.

“In data centers there’s a clear case for OpenFlow, but how quickly it moves into the WAN is a big discussion,” he said. “It’s not completely clear if it will move into public networks, but I expect this year it will become clear,” he added.
TAG:Software Defined Networking Texas Instruments Cisco Systems OpenFlow SDN Stanford Networking Communications Cisco Izzard

2012-07-06

Konarka files for bankruptcy protection

Konarka files for bankruptcy protection


LONDON – Konarka Technologies Inc. (Lowell, Mass.), a developer of thin-film solar panels, has filed for bankruptcy under chapter 7 of the United States federal bankruptcy laws.

This means that the company's operations have ceased and creditors must apply to a court appointed trustee for payment. The trustee is tasked with liquidating the company's assets for the benefit of creditors.

"Konarka has been unable to obtain additional financing, and given its current financial condition, it is unable to continue operations. This is a tragedy for Konarka's shareholders and employees and for the development of alternative energy in the United States," said Howard Berke, chairman, president and CEO of Konarka, in a statement.

Konarka was founded in 2001 by the late Sukant Tripathy, a materials scientist and professor at UMASS Lowell, Alan Heeger, a 2000 Nobel laureate in chemistry and Howard Berke, who served as executive chairman.

The company raised over $170 million in private capital and $20 million in government research grants in an attempt to exploit the research teams discovery of methods to process photovoltaic materials at relatively low temperatures.

Among the assets built up over the decade are hundreds of owned and licensed patents and patent applications in the field of solar energy and a manufacturing plant in New Bedford, Massachusetts.

Interest has been shown in Konarka by several multinational companies and the Chinese government and so there is a possibility of rescue financing or an acquisition, Konarka said in a statement. However, under chapter 7 those possibilities would be evaluated by the trustee not the company itself.

Konarka has German subsidiary based in Nuremberg that has filed for bankruptcy with the Nuremberg District Court's bankruptcy court. Alexander Kubusch of national German insolvency administration firm Curator AG has been appointed as the preliminary insolvency administrator.

"We can sustain the R&D work in Germany without any difficulties at the moment. Nonetheless, our objective must be to find a suitable investor as quickly as possible who's prepared to get the company's first-class development work back on track again and to guarantee its production operations and future developments in the long term, because a successful transfer of the US parent group is currently still very much up in the air," said Kubusch, in a statement.

"If, however, we are able to find an investor and also keep the existing, as well as government research contracts in the company, I have every confidence that the company will be able to keep going long term at its Nuremberg site," he added.


Related links and articles:

Scientists to push organic solar cell efficiency

Heliatek pushes organic solar cell efficiency higher

Half-billion-dollar Nanosolar raises $70 million

Soitec completes CPV solar plant in Italy

Stion begins PV shipments from Hattiesburg factory

IMEC, Kaneka claim 22.7% heterojunction solar cell efficiency



TAG:Konarka Massachusetts PV photovoltaic solar bankruptcy

Konarka files for bankruptcy protection

Konarka files for bankruptcy protection


LONDON – Konarka Technologies Inc. (Lowell, Mass.), a developer of thin-film solar panels, has filed for bankruptcy under chapter 7 of the United States federal bankruptcy laws.

This means that the company's operations have ceased and creditors must apply to a court appointed trustee for payment. The trustee is tasked with liquidating the company's assets for the benefit of creditors.

"Konarka has been unable to obtain additional financing, and given its current financial condition, it is unable to continue operations. This is a tragedy for Konarka's shareholders and employees and for the development of alternative energy in the United States," said Howard Berke, chairman, president and CEO of Konarka, in a statement.

Konarka was founded in 2001 by the late Sukant Tripathy, a materials scientist and professor at UMASS Lowell, Alan Heeger, a 2000 Nobel laureate in chemistry and Howard Berke, who served as executive chairman.

The company raised over $170 million in private capital and $20 million in government research grants in an attempt to exploit the research teams discovery of methods to process photovoltaic materials at relatively low temperatures.

Among the assets built up over the decade are hundreds of owned and licensed patents and patent applications in the field of solar energy and a manufacturing plant in New Bedford, Massachusetts.

Interest has been shown in Konarka by several multinational companies and the Chinese government and so there is a possibility of rescue financing or an acquisition, Konarka said in a statement. However, under chapter 7 those possibilities would be evaluated by the trustee not the company itself.

Konarka has German subsidiary based in Nuremberg that has filed for bankruptcy with the Nuremberg District Court's bankruptcy court. Alexander Kubusch of national German insolvency administration firm Curator AG has been appointed as the preliminary insolvency administrator.

"We can sustain the R&D work in Germany without any difficulties at the moment. Nonetheless, our objective must be to find a suitable investor as quickly as possible who's prepared to get the company's first-class development work back on track again and to guarantee its production operations and future developments in the long term, because a successful transfer of the US parent group is currently still very much up in the air," said Kubusch, in a statement.

"If, however, we are able to find an investor and also keep the existing, as well as government research contracts in the company, I have every confidence that the company will be able to keep going long term at its Nuremberg site," he added.


Related links and articles:

Scientists to push organic solar cell efficiency

Heliatek pushes organic solar cell efficiency higher

Half-billion-dollar Nanosolar raises $70 million

Soitec completes CPV solar plant in Italy

Stion begins PV shipments from Hattiesburg factory

IMEC, Kaneka claim 22.7% heterojunction solar cell efficiency



TAG:Konarka Massachusetts PV photovoltaic solar bankruptcy

Report: Supply chain mobilizes to make iPad Mini

Report: Supply chain mobilizes to make iPad Mini


LONDON – Taiwanese suppliers are getting ready to ship components for the iPad Mini in August to meet a manufacturing start of September, according to a Taiwan Economic News report, that cited unnamed wire services as its sources.

AU Optronics (AUO), F-TPK, and Taiwan Surface Mounting Technology were all mentioned as likely to see strong third quarter sales as a result of the iPad Mini business. AUO makes LCDs while F-TPK is a touch-screen layer manufacturer.

The Apple iPad Mini, with a screen size of 7.85 inch and a resolution of 1024 pixels by 768 pixels is expected to go on sale in September or October at a price of between $249 and $299, the report said. It is expected to ship about 10 million units in 2012.

Component orders for the iPad Mini are expected to have beneficial effect in the Taiwan electronics economy in the second-half of 2013, the report said.

The iPad Mini has been rumored for some time during this year but its introduction would go against the wishes of Apple founder and long-time CEO Steve Jobs, who died in October 2011. It is thought the iPad Mini is being introduced to compete with low-cost rivals such as the Google Nexus 7 and the Amazon Kindle


Related links and articles:

Teardown: Inside Google's Nexus 7 tablet

On Qualcomm's manufacturing options

ARM improves its image in graphics

Pixel Qi claims it can beat iPad display


TAG:supply chain Taiwan semiconductor LCD touch screen

Report: Supply chain mobilizes to make iPad Mini

Report: Supply chain mobilizes to make iPad Mini


LONDON – Taiwanese suppliers are getting ready to ship components for the iPad Mini in August to meet a manufacturing start of September, according to a Taiwan Economic News report, that cited unnamed wire services as its sources.

AU Optronics (AUO), F-TPK, and Taiwan Surface Mounting Technology were all mentioned as likely to see strong third quarter sales as a result of the iPad Mini business. AUO makes LCDs while F-TPK is a touch-screen layer manufacturer.

The Apple iPad Mini, with a screen size of 7.85 inch and a resolution of 1024 pixels by 768 pixels is expected to go on sale in September or October at a price of between $249 and $299, the report said. It is expected to ship about 10 million units in 2012.

Component orders for the iPad Mini are expected to have beneficial effect in the Taiwan electronics economy in the second-half of 2013, the report said.

The iPad Mini has been rumored for some time during this year but its introduction would go against the wishes of Apple founder and long-time CEO Steve Jobs, who died in October 2011. It is thought the iPad Mini is being introduced to compete with low-cost rivals such as the Google Nexus 7 and the Amazon Kindle


Related links and articles:

Teardown: Inside Google's Nexus 7 tablet

On Qualcomm's manufacturing options

ARM improves its image in graphics

Pixel Qi claims it can beat iPad display


TAG:supply chain Taiwan semiconductor LCD touch screen

Chip executives' conference relocates to Bratislava

Chip executives' conference relocates to Bratislava


LONDON – The 2012 meeting of International Electronics Forum, an annual meeting of senior chip executives, will now be held in Bratislava, the capital of Slovakia rather than Yerevan, the capital of Armenia, as previously stated. The Forum dates and focus remain unchanged. The meeting will seek to explore innovation and new markets as drivers for growth and prosperity.

The forum will be held at the Sheraton Hotel, in the newly constructed Eurovea district of Bratislava between Oct. 3 and 5, 2012.

“We had an extremely high level of interest when we selected Yerevan for the Forum but since then the euro crisis and global economic uncertainty have worsened and Armenia was unfortunately starting to become a little too forward-looking for our delegates to justify," said Malcolm Penn, CEO of Future Horizons Ltd. (Sevenoaks, England) the market research and consultancy organization, which organizes the annual forum. "With Bratislava already short-listed for the IEF2013, we decided to switch venues. Slovakia, like Armenia, has a long history of academic and engineering skills but with the added advantage of being part of the EU."

A number of speakers have already committed to address the forum including:

Mojy Chian, senior vice president of design enablement, GlobalFoundries Inc.

VG Gujrathi, TIFAC committee member at the Department of Science & Technology within the Indian government. (former senior general manager at the engineering research center of Tata Motors)

Robert Ober, systems architect at LSI Corp.

Joe Sawicki, vice president and general manager of design-to-silicon, Mentor Graphics;

Ron Collett, President & CEO, Numetrics Management Systems

Chi-Foon Chan, co-CEO and president at Synopsys Inc.


Related links and articles:

Europe asks if it is time for an 'Airbus of chips'

Chip executives' conference is off to Armenia

European report considers 450-mm More-than-Moore fab


Bullish Penn sees chip market growth of 8 percent in 2012


TAG:Malcolm Penn Future Horizons Yerevan Armenia Bratislava Slovakia semiconductor

Chip executives' conference relocates to Bratislava

Chip executives' conference relocates to Bratislava


LONDON – The 2012 meeting of International Electronics Forum, an annual meeting of senior chip executives, will now be held in Bratislava, the capital of Slovakia rather than Yerevan, the capital of Armenia, as previously stated. The Forum dates and focus remain unchanged. The meeting will seek to explore innovation and new markets as drivers for growth and prosperity.

The forum will be held at the Sheraton Hotel, in the newly constructed Eurovea district of Bratislava between Oct. 3 and 5, 2012.

“We had an extremely high level of interest when we selected Yerevan for the Forum but since then the euro crisis and global economic uncertainty have worsened and Armenia was unfortunately starting to become a little too forward-looking for our delegates to justify," said Malcolm Penn, CEO of Future Horizons Ltd. (Sevenoaks, England) the market research and consultancy organization, which organizes the annual forum. "With Bratislava already short-listed for the IEF2013, we decided to switch venues. Slovakia, like Armenia, has a long history of academic and engineering skills but with the added advantage of being part of the EU."

A number of speakers have already committed to address the forum including:

Mojy Chian, senior vice president of design enablement, GlobalFoundries Inc.

VG Gujrathi, TIFAC committee member at the Department of Science & Technology within the Indian government. (former senior general manager at the engineering research center of Tata Motors)

Robert Ober, systems architect at LSI Corp.

Joe Sawicki, vice president and general manager of design-to-silicon, Mentor Graphics;

Ron Collett, President & CEO, Numetrics Management Systems

Chi-Foon Chan, co-CEO and president at Synopsys Inc.


Related links and articles:

Europe asks if it is time for an 'Airbus of chips'

Chip executives' conference is off to Armenia

European report considers 450-mm More-than-Moore fab


Bullish Penn sees chip market growth of 8 percent in 2012


TAG:Malcolm Penn Future Horizons Yerevan Armenia Bratislava Slovakia semiconductor

Teardown: Inside Google's Nexus 7 tablet

Teardown: Inside Google's Nexus 7 tablet


Amazon shook the consumer electronics market last year when it introduced the first sub-$200 tablet, the Amazon Kindle Fire. Many were skeptical of the online vendor’s foray into electronics, but some saw it as a stroke of genius. By leveraging its vast library of online titles, Amazon set itself up to compete on content with industry leader Apple.

The Kindle Fire was an instant hit by combining Amazon’s library of e-books, music and movies with one of the lowest tablet price points featured quality technology. In the fourth quarter of 2011, IDC reported over 6 million units of the Kindle Fire were sold, making Amazon the No. 2 tablet maker with 16.8 percent of the overall market.

Hence, it was strange then that few companies tried to replicate Amazon’s model. Tablet manufacturers are still trying to compete with Apple, releasing products with specifications close to or better than the iPad. The result has been that few tablets under $400.

Perhaps only one company, Google, possesses the resources and the content to offer a tablet capable of taking on the Kindle Fire.

The first Google-branded handset, the Google Nexus One, was manufactured by HTC and was the first to be sold directly by Google to consumers. It served as the template for other Google devices like the Nexus S, the Nexus ONE and the Galaxy Nexus. With each product, Google partnered with an established device manufacturer, focusing its own efforts on the user-interface and optimizing its Android operating system for a particular device.

Google finally introduced its first branded tablet, Nexus 7, at its I/O conference last week (June 27) with a price tag of $199, meaning it will compete directly with the Kindle Fire. The Android OS, particularly Honeycomb, had long been used by iPad competitors. The Nexus 7 tablet also included the latest version of Android, 4.1, or Jelly Bean.

Like Kindle Fire, Nexus 7 offers specifications comparable to other tablets while also taking advantage of the rich library of applications that were available through Google’s Android Market. Featuring a 7-inch display, Nexus 7 also uses Nvidia’s quad-core Tegra 3 processor while also sporting 1 GB of internal RAM and the option of up to 16 Gb of storage.

What's inside?

Since the Tegra 3 processor’s first design win inside the ASUS Transformer Prime, it has been steadily grabbing more socket wins. According to our IRIS database, Tegra 3 has at least five design wins, including a major win in the new Microsoft Surface tablet.

The 1.3-GHz, low power SoC was the first mobile applications processor to incorporate four cores each in the CPU and GPU. The Tegra 3 features “Variable Symmetric Multiprocessing” that uses a single low power core for tasks requiring less power consumption.

Next: New vendors
TAG:Google Nexus 7 Nexus 7 Tablet Nexus 7 Design Wins Teardown Tablet Google IPad Apple

Russian component market to grow 9.5% in 2011, says study

Russian component market to grow 9.5% in 2011, says study


LONDON – The Russian electronics component market is set to grow by 9.5 percent in 2011 to reach an annual size of about $2.6 billion, according to a report prepared by the Association of Suppliers of Electronic Components (ASPEC), a trade association for Russian distributors.

In 2010 the Russian components market, including semiconductors, passives and electromechanical components, was worth about $1.9 billion and it grew by 25 percent to reach an annual value of $2.4 billion, the association estimates.

The main feature of the Russian market is the large number of small and medium customers and the importance of distributors.

The top 30 Russian customers for electronic components have a market share worth about 30 percent of the market. About 400 large- and medium-sized customers take about 80 percent of the components by value and the remaining 20 percent of the market is taken by 3,000 small customers, according to ASPEC. The largest sectors in the Russian market are industrial and military electronics.

Local Russian distribution companies are responsible for about 65 percent of the market while direct sales from multinational distributors are responsible for a further 10 percent. Russian manufacturers of components hold about 30 percent of the market and their products are sold mainly into military and aerospace assembly, the group states.

More information on the Russian electronic components market is available in an 88-page report covering research conducted from February to April, 2012


Related links and articles:

Russian components market report

www.aspecfr.org

News articles:


Plastic Logic demos flexible color moving display

Microsoft and Skolkovo Foundation cooperate on cloud

Russia drives into U.S. fabless funding

NeoPhotonics deals with Rusnano, plans facilities in Russia

Rusnano helps close $79 million Quantenna deal

Mikron signs to use Rambus crypto patents


TAG:Russia component market semiconductor passives electromechanical MEMS

Russian component market to grow 9.5% in 2011, says study

Russian component market to grow 9.5% in 2011, says study


LONDON – The Russian electronics component market is set to grow by 9.5 percent in 2011 to reach an annual size of about $2.6 billion, according to a report prepared by the Association of Suppliers of Electronic Components (ASPEC), a trade association for Russian distributors.

In 2010 the Russian components market, including semiconductors, passives and electromechanical components, was worth about $1.9 billion and it grew by 25 percent to reach an annual value of $2.4 billion, the association estimates.

The main feature of the Russian market is the large number of small and medium customers and the importance of distributors.

The top 30 Russian customers for electronic components have a market share worth about 30 percent of the market. About 400 large- and medium-sized customers take about 80 percent of the components by value and the remaining 20 percent of the market is taken by 3,000 small customers, according to ASPEC. The largest sectors in the Russian market are industrial and military electronics.

Local Russian distribution companies are responsible for about 65 percent of the market while direct sales from multinational distributors are responsible for a further 10 percent. Russian manufacturers of components hold about 30 percent of the market and their products are sold mainly into military and aerospace assembly, the group states.

More information on the Russian electronic components market is available in an 88-page report covering research conducted from February to April, 2012


Related links and articles:

Russian components market report

www.aspecfr.org

News articles:


Plastic Logic demos flexible color moving display

Microsoft and Skolkovo Foundation cooperate on cloud

Russia drives into U.S. fabless funding

NeoPhotonics deals with Rusnano, plans facilities in Russia

Rusnano helps close $79 million Quantenna deal

Mikron signs to use Rambus crypto patents


TAG:Russia component market semiconductor passives electromechanical MEMS

Nuclear fusion research aids EUV source breakthrough

Nuclear fusion research aids EUV source breakthrough


LONDON – A University of Washington laboratory that has been working for more than a decade on nuclear fusion as a source of energy, thinks it has leapfrogged ahead of companies trying to create a viable light source for extreme ultraviolet lithography (EUV).

Zplasma Inc. (Seattle, Wash.) will be competing with such firms as Cymer Inc., Xtreme Technologies GmbH and Gigaophoton Inc. but reckons that with a 1,000 times improvement in output energy it can easily provide the source power to make EUV lithography machine throughputs viable.

The principle methods used currently are discharged-produced or laser produced plasmas of xenon or tin (DPP or LPP) but both consume large amounts of energy. More importantly neither has reached the 100- or 200-watts power level at the intermediate focus needed to get 60 to 125 wafers per hour throughput from a EUV lithography machine, such as the NXE:3300B from ASML Holding NV (Veldhoven, The Netherlands).

"We're able to produce that light with enough power that it can be used to manufacture microchips," said Uri Shumlak, a UoW professor of aeronautics and astronautics, in a report on the University of Washington website.





Click on image to enlarge.

The University of Washington nuclear fusion lab includes a tank containing plasma for energy research as well as a smaller system for electronics applications. Source: University of Washington


TAG:University of Washington Nuclear fusion research EUV lithography semiconductor ASML

Nuclear fusion research aids EUV source breakthrough

Nuclear fusion research aids EUV source breakthrough


LONDON – A University of Washington laboratory that has been working for more than a decade on nuclear fusion as a source of energy, thinks it has leapfrogged ahead of companies trying to create a viable light source for extreme ultraviolet lithography (EUV).

Zplasma Inc. (Seattle, Wash.) will be competing with such firms as Cymer Inc., Xtreme Technologies GmbH and Gigaophoton Inc. but reckons that with a 1,000 times improvement in output energy it can easily provide the source power to make EUV lithography machine throughputs viable.

The principle methods used currently are discharged-produced or laser produced plasmas of xenon or tin (DPP or LPP) but both consume large amounts of energy. More importantly neither has reached the 100- or 200-watts power level at the intermediate focus needed to get 60 to 125 wafers per hour throughput from a EUV lithography machine, such as the NXE:3300B from ASML Holding NV (Veldhoven, The Netherlands).

"We're able to produce that light with enough power that it can be used to manufacture microchips," said Uri Shumlak, a UoW professor of aeronautics and astronautics, in a report on the University of Washington website.





Click on image to enlarge.

The University of Washington nuclear fusion lab includes a tank containing plasma for energy research as well as a smaller system for electronics applications. Source: University of Washington


TAG:University of Washington Nuclear fusion research EUV lithography semiconductor ASML

2012-07-05

Ramtron rejects Cypress again, in talks with others

Ramtron rejects Cypress again, in talks with others


LONDON – The board of ferroelectric memory company Ramtron has rejected the latest, improved offer from Cypress Semiconductor and is now in discussions with "major semiconductor companies" about a potential strategic transaction.

It is not clear whether that transaction, which remains only a possibility, would be a sell-off of all or part of the company or the formation of a joint venture.

Ramtron International Corp. (Colorado Springs, Colo.) announced it has rejected an offer from Cypress Semiconductor Corp. (San Jose, Calif.) to acquire the firm for $2.68 per share. This is an improved offer from the previous Cypress tender of $2.48 per share.

In a statement Ramtron pointed out that its stock has been trading at above the Cypress offer price since Cypress went public on its attempts to buy the company. On Tuesday (July 3) Ramtron stock closed at $3.01 and market valuation of about $104 million.

Last month Cypress went public with the offer to buy Ramtron for roughly $86 million. Cypress said it also bid to acquire Ramtron for $3.01 per share back in 2011.

"Even at an offer price of $2.68 per share, we continue to believe the offer fails to reflect the Company's strengthened competitive position, enlarged addressable market and progress being made toward expanding the Company's product portfolio beyond specialty memory products to also include integrated semiconductor solutions," said William Howard, Ramtron's Chairman, in the statement.

In Schedule 14D-9 form that Ramtron said it is filing Thursday (July 5) with the Securities and Exchange Commission the company discloses it is investigating a potential sale of the company; a strategic alignment with one or more investors or joint venture counterparties; other potential strategic transactions to recognize the long-term value of the company for its stockholders; or continuing with the company's current plans.

Ramtron said Cypress had been invited to take part in that strategic alternatives review process but had made no effort to participate and had chosen instead to bypass the process and make its unsolicited tender offer.

Ramtron said it is now engaged in discussions with a number of other parties, including major semiconductor companies, regarding a potential transaction.


Related links and articles:

www.ramtron.com

www.cypress.com

News articles:


Cypress increases offer for Ramtron

Ramtron rejects Cypress Semi offer

Cypress goes public on offers to buy Ramtron

Ramtron launches low-energy FRAM

Ramtron says its shipping FRAMs from IBM line

FRAM helps TI cut power for Wolverine MSP430 platform

TAG:Ramtron Cypress ferroelectric memory FRAM non volatile semiconductor Colorado

Study assesses material constraints for concentrating solar power

Study assesses material constraints for concentrating solar power

PARIS – Concentrating Solar Power (CSP) is largely unrestricted by materials availability. Theoretically, enough solar plants could be built to cover at least five times the current global electricity demand, according to a study by Chalmers University of Technology in Sweden.

The report provides an assessment of potential material restrictions for a large-scale application of CSP technology using data from an existing parabolic trough plant and one prospective state-of-the-art tower plant.

In general, most of the materials needed for CSP are commonplace. There are, however, some issues that the industry needs to take into consideration, the study stated. A key concern is that silver, now used for reflecting surfaces, will be in short supply in the coming decades even without demand from a growing CSP industry. CSP mirror manufacturers may have to examine other reflective surface materials, including aluminium, to guarantee cost competitiveness.

The need for nitrate salts (NaNO3 and KNO3) and steel alloys (Nb, Ni and Mo) would also be significant if CSP grows to be a major global electricity supply. Based on a high adoption scenario where CSP reaches 8000 TWh/year in 2050, the study indeed outlined that the solar plants would consume up to 50-120 percent of today’s annual nitrate salt production, and 5-15 percent of several common materials such as glass, nickel, magnesium and molybdenum.

“Parabolic trough plants tend to use a lot of concrete and iron, while the concept of small heliostat tower plants has a higher use of aluminium and stainless steel,” declared Dr Erik Pihl, at the Chalmers University of Technology. “The common design of a parabolic trough plant also requires more molten salt per MW than a salt-receiver tower plant, even when the former has fewer storage hours. That means that trough plants appear slightly more sensitive than tower plants to possible salt production bottlenecks, unless other storage techniques can be employed.”

Pihl said he expects that material demands for plants will decline as we move for higher steam temperatures and increased plant efficiency. And, in the short term, the priority is to replace silver in mirrors and increase nitrate salt production.




TAG:Thermal electricity Solar energy RES Material reserves Resource scarcity

Ramtron rejects Cypress again, in talks with others

Ramtron rejects Cypress again, in talks with others


LONDON – The board of ferroelectric memory company Ramtron has rejected the latest, improved offer from Cypress Semiconductor and is now in discussions with "major semiconductor companies" about a potential strategic transaction.

It is not clear whether that transaction, which remains only a possibility, would be a sell-off of all or part of the company or the formation of a joint venture.

Ramtron International Corp. (Colorado Springs, Colo.) announced it has rejected an offer from Cypress Semiconductor Corp. (San Jose, Calif.) to acquire the firm for $2.68 per share. This is an improved offer from the previous Cypress tender of $2.48 per share.

In a statement Ramtron pointed out that its stock has been trading at above the Cypress offer price since Cypress went public on its attempts to buy the company. On Tuesday (July 3) Ramtron stock closed at $3.01 and market valuation of about $104 million.

Last month Cypress went public with the offer to buy Ramtron for roughly $86 million. Cypress said it also bid to acquire Ramtron for $3.01 per share back in 2011.

"Even at an offer price of $2.68 per share, we continue to believe the offer fails to reflect the Company's strengthened competitive position, enlarged addressable market and progress being made toward expanding the Company's product portfolio beyond specialty memory products to also include integrated semiconductor solutions," said William Howard, Ramtron's Chairman, in the statement.

In Schedule 14D-9 form that Ramtron said it is filing Thursday (July 5) with the Securities and Exchange Commission the company discloses it is investigating a potential sale of the company; a strategic alignment with one or more investors or joint venture counterparties; other potential strategic transactions to recognize the long-term value of the company for its stockholders; or continuing with the company's current plans.

Ramtron said Cypress had been invited to take part in that strategic alternatives review process but had made no effort to participate and had chosen instead to bypass the process and make its unsolicited tender offer.

Ramtron said it is now engaged in discussions with a number of other parties, including major semiconductor companies, regarding a potential transaction.


Related links and articles:

www.ramtron.com

www.cypress.com

News articles:


Cypress increases offer for Ramtron

Ramtron rejects Cypress Semi offer

Cypress goes public on offers to buy Ramtron

Ramtron launches low-energy FRAM

Ramtron says its shipping FRAMs from IBM line

FRAM helps TI cut power for Wolverine MSP430 platform

TAG:Ramtron Cypress ferroelectric memory FRAM non volatile semiconductor Colorado

Soap film forms textured display screen

Soap film forms textured display screen


LONDON – A team of scientists from the University of Tokyo, Carnegie Mellon University and the University of Tsukuba have demonstrated the possibility of using a soap film to form a video projection display screen with dynamic texturing.

The soap film is backlit and the display on the screen is excited using ultrasound vibrations which can used to control transparency and surface states of the screen. The sound waves alter the visual texture of a projected image.

"We developed an ultra thin and flexible BRDF [bidirectional reflectance distribution function] screen using the mixture of two colloidal liquids. There have been several researches on dynamic BRDF display in the past. However, our work is different in several points. Our membrane screen can be controlled using ultrasonic vibrations. Membrane can change its transparency and surface states depending on the scales of ultrasonic waves," Yoichi Ochiai from the University of Tokyo, wrote in his blog.

The technique is the subject of patent application.

No indication is given of the practical or theoretical maximum size or resolution for the display. The soap bubble is made from a colloidal liquid that Ochiai describes as being "not easily popped." Indeed video evidence shows it is possible to pass a wetted object through the film without causing it to break down.

Ochiai and colleagues have also prepared a video which they have posted on YouTube.




Colloidal projection display screen in action
TAG:Carnegie Mellon Soap Tokyo research display science

Soap film forms textured display screen

Soap film forms textured display screen


LONDON – A team of scientists from the University of Tokyo, Carnegie Mellon University and the University of Tsukuba have demonstrated the possibility of using a soap film to form a video projection display screen with dynamic texturing.

The soap film is backlit and the display on the screen is excited using ultrasound vibrations which can used to control transparency and surface states of the screen. The sound waves alter the visual texture of a projected image.

"We developed an ultra thin and flexible BRDF [bidirectional reflectance distribution function] screen using the mixture of two colloidal liquids. There have been several researches on dynamic BRDF display in the past. However, our work is different in several points. Our membrane screen can be controlled using ultrasonic vibrations. Membrane can change its transparency and surface states depending on the scales of ultrasonic waves," Yoichi Ochiai from the University of Tokyo, wrote in his blog.

The technique is the subject of patent application.

No indication is given of the practical or theoretical maximum size or resolution for the display. The soap bubble is made from a colloidal liquid that Ochiai describes as being "not easily popped." Indeed video evidence shows it is possible to pass a wetted object through the film without causing it to break down.

Ochiai and colleagues have also prepared a video which they have posted on YouTube.




Colloidal projection display screen in action
TAG:Carnegie Mellon Soap Tokyo research display science

Toshiba fined $87 million for LCD price-fixing

Toshiba fined $87 million for LCD price-fixing


LONDON – Toshiba Corp. and its U.S. subsidiary Toshiba America Electronic Components Inc. have been fined $87 million for anti-trust practices in the LCD business.

A jury in the United States District Court for the Northern District of California (San Francisco) issued the verdict on a case brought in 2007 as a class action by purchasers of LCD panels.

Toshiba said the verdict against it is wrong and that it plans to pursue all available legal avenues in its defense.


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TAG:Toshiba LCD price price fixsing display legal court fine

Toshiba fined $87 million for LCD price-fixing

Toshiba fined $87 million for LCD price-fixing


LONDON – Toshiba Corp. and its U.S. subsidiary Toshiba America Electronic Components Inc. have been fined $87 million for anti-trust practices in the LCD business.

A jury in the United States District Court for the Northern District of California (San Francisco) issued the verdict on a case brought in 2007 as a class action by purchasers of LCD panels.

Toshiba said the verdict against it is wrong and that it plans to pursue all available legal avenues in its defense.


Related links and articles:


Toshiba backs LED firm Bridgelux

Pixel Qi claims it can beat iPad display

Sharp to transfer LCD technology to Hon Hai’s China plant

TAG:Toshiba LCD price price fixsing display legal court fine

缤纷夏日 Forevermark永恒印记炫彩钻石吊坠

缤纷夏日 Forevermark永恒印记炫彩钻石吊坠

全新Forevermark永恒印记Summer Look夏日炫彩系列美钻项链隆重上市。汇集Forevermark永恒印记品牌多款璀璨的美钻吊坠,无论是线条流畅的Encordia拥爱系列,亦或充满女性之美的Millemoi拥幻系列等款式,搭配时下风行日本的缤纷彩链,百变搭配,卓然品味。

缤纷夏日 Forevermark永恒印记炫彩钻石吊坠

缤纷夏日 Forevermark永恒印记炫彩钻石吊坠

铅笔色大行其道,轻薄面料的加入,为今夏带来一抹朦胧的柔美,富于细节的剪纸印花,精致美感的立体花朵装饰,回归50年代的复古风格,或宫廷繁复,或极致简约,无一不是今季的潮流热点,与此同时,中性装扮和运动风也是今夏的亮点,无需过多的修饰, 花一点点心思,精心选择一枚ForevermarkTM永恒印记Summer Look夏日炫彩系列美钻项链于清爽的颈间,钻石灵动的火彩绽放个人魅力,缤纷的彩链与热辣的夏日完美融合,注重细节,巧妙搭配,在这个多彩的夏日,完美展示唯属于你的缤纷美丽!




TAG:Forevermark 永恒印记 钻石吊坠 铅笔色

60多件石后将亮相海峡艺交会

60多件石后将亮相海峡艺交会

  本报讯 由福建海峡文化产权交易所推出的第七届海峡艺术品交流会(简称“海峡艺交会”)——寿山石专场,将于本周末举办.记者昨日获悉,此次艺交会不仅有众多名家作品,而且在此次亮相的170件寿山石作品中,被称为“石后”的芙蓉石藏品就有60多件,占了三分之一.

结晶性芙蓉石《福气连连》把玩件 1.7×7.2×4.5cm结晶性芙蓉石《福气连连》把玩件 1.7×7.2×4.5cm芙蓉石《如意钮扁章》6.4×3.4×2cm芙蓉石《如意钮扁章》6.4×3.4×2cm

  芙蓉石送件踊跃

  由于最早开采,田黄从清代起就被尊为“石帝”,而芙蓉石素来有“石后”的美称.

  此次是海峡文化产权交易所今年举办的第四场寿山石交流会,与往届相比,此次亮相芙蓉石是最多的,而且基本是印章和把玩件.

  主办方表示,在此次藏品征集过程中,藏家对芙蓉石送件极为踊跃,收藏爱好者本周末有机会淘到更多芙蓉石.

  据介绍,除了结晶性芙蓉石《福气连连》把玩件,芙蓉石印章和把玩件还有50多件,其中135号藏品,是一方芙蓉石如意钮扁章,规格达到了6.4厘米×3.4厘米×2厘米,藏家的委托价是5000元.此外,112号藏品(芙蓉石如意套章)的雕刻风格与135号是一样的,材质也是颜色相当的青芙蓉石.

芙蓉石《如意》套章芙蓉石《如意》套章

  网上可提前预览

  虽然第七届海峡艺交会举办的时间是7月7日和8日两天,但是文交所工作人员称,在交流会还没举办之前,不少寿山石雕已经被人“相中”了.

  根据交流会规则,所有藏品一律明码标价,先付款者先得,省去了中间的议价环节,确保了交易的透明和公平.

  买家购买的价格就是藏家送件的委托价.如果藏品成交了,卖方只需缴纳10%的佣金,不成交则不需要支付任何费用.

  此外,第七届海峡艺交会的所有藏品已提前五天,也就是从本周一开始在网上预览,网上预览时间比前面六届增加了两天.市民在海峡文交所网站(www.fjhxcaee.com)可以看到交流会图录及价格.市民上寿山石文化网(www.ssswh.com)也能看到图录及价格.

  小贴士

  第七届福建海峡艺术品交流会——寿山石专场

  活动时间:7月7日—8日(10:00—17:30)

  活动地址:福州市杨桥东路(双抛桥)衣锦华庭寿山石文化城二楼——福建省民间艺术馆展览厅.



来源:新浪收藏
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TAG:60多件石后将亮相海峡艺交会 翡翠 翡翠手镯 feicui 翡翠观音 jade 七彩云南 云南翡翠 缅甸翡翠 瑞丽翡翠

小钱买金大钱购玉

小钱买金大钱购玉

  以往年份中,7~8月,烈日炎炎,需求寡淡,黄金与翡翠价格往往降至年内新低;今年年中,受经济大环境影响,黄金翡翠的价格均有下跌,金价连连跌价之后,进入了长时间的弱市,目前反弹后,依然在1600美元的低位徘徊。

  对于广大市民来说,两个市场似乎都有抄底机缘,是先抄“金”,还是先抄“玉”(翡翠是硬玉,超越了和田玉,目前是国际珠宝市场的主力交易品种),的确值得权衡。

  文、图/记者 井楠

  本周,记者去云南翡翠原材料市场实地勘察,全面对比了翡翠和黄金的投资价值,综合业内人士的观点认为:黄金投资的操作性强、容易回购、投资起点低,比较适合大众投资者购买,抄底应分步,规避进一步的走跌风险。而对于大资金投资者与追求长线收藏价值、收藏安全性的市民,建议适当购买顶级、高档翡翠。

  需要强调的是:收藏类翡翠仅在翡翠市场中占据不到5%的比例,成品价格多在50万元以上,也只有这部分翡翠才可以与黄金相提并论,成为市民抄底的讨论对象;其余翡翠的价值偏重于佩戴,并不具备增值空间。

  行情PK:金价跌幅大翡翠走稳

  黄金与翡翠相比,哪个价格更接近底部?单从价格回落幅度上来说,黄金价格略胜一筹,从去年8月底的历史高位1920美元,最低降到了1530美元附近位置,目前也依然是在1600美元附近位置盘旋。而对于收藏级别的高档、顶级翡翠来说,价格并没出现明显下跌。

  不过,跌价跌得多,并不代表就已经是“底”了。多数国内的技术派人士认为,金价下半年的走势将仍以弱市振荡为主,距离1530美元位置仍有约16%的跌幅;目前抄底黄金,未来几个月仍有被套的风险。

  而记者广泛走访云南边境市场后发现,高档、顶级翡翠的跌价空间并不大,市场回暖气息明显。一方面,缅甸政府限制挖掘、老矿资源面临枯竭,导致顶级翡翠原材料价格稀缺;另外一个方面,由于投资市场疲软,大城市富裕阶层急寻资金出路,高档翡翠的需求急剧上升。瑞丽的高档珠宝商,如元亨利、万明珠宝等,每日都能接待多名来自上海、北京的顾客,咨询“千万元单价”翡翠的电话更是络绎不绝,需求可见一斑。

  资金量PK:小资金抄金 大资金买翡翠

  对于资金量有限的投资者,主要是指投资金额在50万元以下的个人、家庭,抄底黄金应该更加可行。比较翡翠来说,真金白银更容易变现、操作更简单,更适合大众投资者的偏好。

  而挑选翡翠难度很大,价格衡量尺度不一,小资金参与投资的风险较大。

  同时,记者在云南、广东的翡翠市场发现:经过历年涨价,业内人士眼中:2万元以下的翡翠只能被称为低档货,十几万元的翡翠也仅仅是一般性消费品;收藏级翡翠成品的价格底线一般在50万元。

  如果只有二三十万元“抄底”资金,是无法成功收藏翡翠的。

  而对于大资金量的投资者,翡翠是分散投资的理想工具。

  一方面,翡翠体积小、价值高,一只满绿手镯的市场批发价格高达几千万元,一块冰种紫色吊坠,几百万元的居多,相对于黄金更便于保存,安全性较好。

  另外一个方面,大资金做投资,求的都是长线升值空间,随着矿产资源的枯竭,翡翠的长线增值前景强过黄金,存在爆发性增长的可能性。

  回购市场PK:

  黄金回购通畅

  买进了投资品,是否可以卖出?也是投资者权衡抄底时机的重要依据。在这方面,黄金市场胜一筹。广州市内,早在2005年,就兴办起了黄金回购超市,现在来说,各类黄金回购网点遍布市内,商场、黄金公司、部分银行都接纳回购业务,比较著名的地点有广东粤宝黄金(博客,微博)、亚洲国家大酒店黄金超市、东山百货黄金超市等等。

  回购价格一般在当日上海黄金交易所现货金价上减去3%~10%不等的手续费。

  与之相比,国内的翡翠回购市场仍在酝酿之中,10万元以下中低档翡翠的回购业务依然遥遥无期。即使对于我们探讨的收藏级翡翠,也并不存在权威的价值鉴定体系与明码标价的回购网点。

  部分大型珠宝商家也做回购业务,但也仅仅是蜻蜓点水、只收高档、顶级货色,收购价格往往比零售价格低出很多。

  不过,广东粤宝的朱志刚认为:回购市场不健全的“弊病”也可以看做是大资金投资翡翠的优势。因为缺乏权威的价值评估体系,绝大多数人容易忽视翡翠的高昂价值,投资者储藏翡翠反而比较安全。

  据珠宝业内人士介绍,曾有北京顾客家中惨遭盗窃,金首饰被偷光了,价值千万元的满绿翡翠手镯却还安然无恙,警方推断:窃贼不识货或以为手镯是B货。


TAG:小钱买金大钱购玉

石后亮相第七届海峡艺交会

石后亮相第七届海峡艺交会

  N本报记者 欧阳进权

  本报讯 由福建海峡文化产权交易所推出的第七届海峡艺术品交流会(简称“海峡艺交会”)寿山石专场,将于本周末举办。记者昨日获悉,此次艺交会不仅有众多名家作品,而且在此次亮相的170件寿山石作品中,被称为“石后”的芙蓉石藏品就有60多件,占了三分之一。

  芙蓉石送件踊跃

  由于最早开采,田黄从清代起就被尊为“石帝”,而芙蓉石素来有“石后”的美称。

  此次是海峡文化产权交易所今年举办的第四场寿山石交流会,与往届相比,此次亮相芙蓉石是最多的,而且基本是印章和把玩件。

  主办方表示,在此次藏品征集过程中,藏家对芙蓉石送件极为踊跃,收藏爱好者本周末有机会淘到更多芙蓉石。

  据介绍,除了结晶性芙蓉石《福气连连》把玩件,芙蓉石印章和把玩件还有50多件,其中135号藏品,是一方芙蓉石如意钮扁章,规格达到了6.4厘米×3.4厘米×2厘米,藏家的委托价是5000元。此外,112号藏品(芙蓉石如意套章)的雕刻风格与135号是一样的,材质也是颜色相当的青芙蓉石。

  网上可提前预览

  虽然第七届海峡艺交会举办的时间是7月7日和8日两天,但是文交所工作人员称,在交流会还没举办之前,不少寿山石雕已经被人“相中”了。

  根据交流会规则,所有藏品一律明码标价,先付款者先得,省去了中间的议价环节,确保了交易的透明和公平。

  买家购买的价格就是藏家送件的委托价。如果藏品成交了,卖方只需缴纳10%的佣金,不成交则不需要支付任何费用。


TAG:石后亮相第七届海峡艺交会

.Advantech aims boards at the Internet of Things

.Advantech aims boards at the Internet of Things


Advantech Corp. (Taipei, Taiwan), a vendor of embedded single-board computers, is aiming to dominate the Internet of Things with embedded devices and management software in a shift of strategy.

The company, which was the leading embedded PC vendor in 2011 with over 25 percent of the market, sees the opportunities in the intelligent sensor and gateway devices, coupled with security and cloud management software.

Advantech Industrial Cloud Services is also making its SUSI-Access cloud software available on all its embedded platforms. This allows system integrators to centralize monitoring and management of remote embedded devices in real time. The cloud-based application is free for customers and centralizes monitoring of all remote embedded device. It collects all device data and provides logs for remote management. When errors occur it auto-notifies the system administrator via warning opups and email alerts. If there’s a major failure the applications automatically reboots to run diagnostics and deploy system recovery procedures.

Advantech has also launched a series of wireless I/O modules using the same 802.15.4 mesh networking standard as Zigbee with sensors.

The ADAM-2000Z series includes six modules including a Modbus/RTU gateway, router node and I/O and sensors. The modules run for a year from two AA batteries and include a wireless site survey tool in the ADAM software utility.

The Modbus protocol allows the modules to be integrated into HMI and SCADA networks. The modules include a wireless temperature and humity sensor node as well as 6 channel analogue and 8 channel digital versions.

This article was first published by sister publication EE Times Europe.



Related links and articles:

www.advantech.eu

www.advantech.com

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TAG:Internet of Things Embedded PC Advantech Taipei IoT boards

ST supports study lab in northeast China

ST supports study lab in northeast China


LONDON – STMicroelectronics and Harbin Institute of Technology (HIT) in northeastern China have announced the opening of a joint laboratory with the aim of supporting the study, research and development of applications in medical electronics, power management and multimedia convergence.

The laboratory will start with work on smart-sensor applications using iNemo development tools.

ST did not indicate how much money, if any, it was investing in the project or how many students and researchers would work in the laboratory.

ST said it will provide IC samples, technical documentation and training to help students while HIT will provide the facilities and the managers.

"We expect the joint lab will contribute to the nurturing of the next generation of engineers and should create new reference designs for the industry," said Patrick Boulaud, ST's regional vice president for analog, MEMS and sensors, in a statement. "ST is on the cutting-edge of the MEMS technology revolution and our cooperation with ST gives faculty and students access to the most advanced design tools," said Professor XU Dianguo, assistant principal of HIT, in the same statement.


Related links and articles:

Chinese startup offers tri-axis accelerometer

Hanking starts building Chinese MEMS wafer fab

MEMS wafer maker Okmetic outsources amid SOI push

TAG:ST Harbin MEMS multimedia power semiconductor study research development

ST supports study lab in northeast China

ST supports study lab in northeast China


LONDON – STMicroelectronics and Harbin Institute of Technology (HIT) in northeastern China have announced the opening of a joint laboratory with the aim of supporting the study, research and development of applications in medical electronics, power management and multimedia convergence.

The laboratory will start with work on smart-sensor applications using iNemo development tools.

ST did not indicate how much money, if any, it was investing in the project or how many students and researchers would work in the laboratory.

ST said it will provide IC samples, technical documentation and training to help students while HIT will provide the facilities and the managers.

"We expect the joint lab will contribute to the nurturing of the next generation of engineers and should create new reference designs for the industry," said Patrick Boulaud, ST's regional vice president for analog, MEMS and sensors, in a statement. "ST is on the cutting-edge of the MEMS technology revolution and our cooperation with ST gives faculty and students access to the most advanced design tools," said Professor XU Dianguo, assistant principal of HIT, in the same statement.


Related links and articles:

Chinese startup offers tri-axis accelerometer

Hanking starts building Chinese MEMS wafer fab

MEMS wafer maker Okmetic outsources amid SOI push

TAG:ST Harbin MEMS multimedia power semiconductor study research development

2012-07-04

ARM, HP, SK Hynix join Hybrid Memory Cube group

ARM, HP, SK Hynix join Hybrid Memory Cube group


LONDON – ARM, Hewlett-Packard and SK Hynix have joined the Hybird Memory Cube Consortium (HMCC) led by Micron and Samsung, a sign of gathering momentum for this proposed application of 3-D memory stacks.

The three companies, which have technology expertise in processors, computers and memory, join Altera, IBM, Microsoft, Open-Silicon, Xilinx as well as Micron and Samsung working to draft an open interface specification for stacked memory.

One of the motivations for forming the HMCC is that the memory bandwidth required for next-generation high-performance computers and networking equipment has increased beyond what conventional memory architectures can provide. Breaking through the "memory wall" will require increased density and bandwidth at reduced power consumption, a goal of HMCC.

HMCC plans to deliver a final interface specification by the end of 2012.

"With the addition of ARM, HP and SK hynix as developers, who will help to determine the specific features, the consortium is well positioned to provide a new open standard for next-gen electronics," said Robert Feurle, Micron's vice president for DRAM marketing, in a statement.


Related links and articles:

www.hybridmemorycube.org

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Micron broadening support for memory cube

IBM, Micron to build hybrid memory with TSVs

Micron, Samsung seek hybrid memory specification


TAG:Hybrid Memory Cube SK Hynix ARM HP Micron Samsung semiconductor HMCC DRAM memory stacked

ARM, HP, SK Hynix join Hybrid Memory Cube group

ARM, HP, SK Hynix join Hybrid Memory Cube group


LONDON – ARM, Hewlett-Packard and SK Hynix have joined the Hybird Memory Cube Consortium (HMCC) led by Micron and Samsung, a sign of gathering momentum for this proposed application of 3-D memory stacks.

The three companies, which have technology expertise in processors, computers and memory, join Altera, IBM, Microsoft, Open-Silicon, Xilinx as well as Micron and Samsung working to draft an open interface specification for stacked memory.

One of the motivations for forming the HMCC is that the memory bandwidth required for next-generation high-performance computers and networking equipment has increased beyond what conventional memory architectures can provide. Breaking through the "memory wall" will require increased density and bandwidth at reduced power consumption, a goal of HMCC.

HMCC plans to deliver a final interface specification by the end of 2012.

"With the addition of ARM, HP and SK hynix as developers, who will help to determine the specific features, the consortium is well positioned to provide a new open standard for next-gen electronics," said Robert Feurle, Micron's vice president for DRAM marketing, in a statement.


Related links and articles:

www.hybridmemorycube.org

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Microsoft joins Micron memory cube effort


Micron broadening support for memory cube

IBM, Micron to build hybrid memory with TSVs

Micron, Samsung seek hybrid memory specification


TAG:Hybrid Memory Cube SK Hynix ARM HP Micron Samsung semiconductor HMCC DRAM memory stacked

Scientists to push organic solar cell efficiency

Scientists to push organic solar cell efficiency

PARIS – Researchers from the Karlsruhe Institute of Technology (KIT) have launched a four-year research program that aims to improve the efficiency of organic solar cells to more than 10 percent.

Organic solar cells are cheaper to produce, lighter and more flexible than traditional silicon-based solar cells, opening new perspectives in particular for the architectural design of buildings. Solar modules can be integrated in facades and even windows. The downside is that the efficiency rate of OPV cells remains much lower than inorganic solar cells, demonstrating 15-20 percent efficient.

Led by Dr. Alexander Colsmann, at KIT's Light Technology Institute, the newly-launched project uses tandem architectures. Two solar cells with complementary absorption characteristics are stacked directly on top of each other to achieve better sunlight harvesting and more efficient energy conversion.

The KIT scientists said they use novel materials, develop innovative device architectures, optimize their stability, and test the solar cells in a real-life environment. They also intend to transfer manufacturing processes from the laboratory to an industry-compatible production environment so as to promote future commercial use of their results.


Source KIT

TAG:Karlsruhe Institute of Technology Solar Cells Efficiency Organic OPV